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FILE DUMP REALME C2 RMX1941

FILE DUMP REALME C2 RMX1941

BENGKEL HP by BENGKEL HP
November 22, 2020
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FILE DUMP REALME C2 16 GB

FILE DUMP REALME C2 RMX1941, pada kesempatan kali ini admin akan membagikan file direct emmc atau ganti emmc realme 2 16 gb. bagi teman teman yang membutuhkan silahkan di download gratis.

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FILE DUMP REALME C2 16 GB

DOWNLOAD FILE DUMP REALME C2 16 GB

VCCQ not properly connected
Init bus…
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) – High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x03, serial number: 0x1F329B15
Manufacturing date: May 2019
CID: 15010051 4536334D 42031F32 9B155616
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: Realme
board: RM6762_18540, name:
brand: , model:
build id: PPR1.180610.011, version: 9 Pie ()
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190517.234935 release-keys
Internal storage: 9.08 GiB

FILE DUMP REALME C2 RMX1941

DOWNLOAD FILE DUMP REALME C2 32 GB

VCCQ not properly connected
Init bus…
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) – High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xAC5AC6CD
Manufacturing date: Jan 2019
CID: 15010051 4436334D 4203AC5A C6CD162C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to “\%BACKUPS%\QD63MB_AC5AC6CD.ext_csd”
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: Realme
board: RM6762_18540, name:
brand: , model:
build id: PPR1.180610.011, version: 9 Pie ()
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190517.234935 release-keys
crypto state: encrypted?
crypto state: encrypted?

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